XDX-XDF160f electronic component detector adopts r160 digital imaging system for imaging, 0.1 microfocus ray tube for intensive beam scattered rays, digital imaging, clear image, full digital software operation function of the instrument, positive and negative image selection, image magnification and reduction, left and right rotation, Front and back rotation, flipping, digital high-definition gray-scale professional image collection, Gigabit network end wired and wireless connection, computer instant imaging, storage and instant printing of test effect pictures. Portable design, convenient use, safety, reliability, easy to carry.

2、 Instrument features

Xdxi-r160f electronic component nondestructive tester, Mainly for the electronic components, packaging elements, BGA, CPU, IC chip, semiconductor components, integrated circuit, circuit board, electric heating tube, heating tube, whether the internal structure of electronic products is deformed, desoldered, empty welding displacement, etc. of the electronic components factory, electric heating wire factory, connector factory; at the same time, it can also be used for the detection of toys, Cordyceps, broken needles, metal foreign matters, etc

Instrument technical parameters:

1. Digital imaging field of view: 130x160mm (customized for different areas)
2. Pixel spacing: 125um;
3.  spacing: 260mm;
4. A / D conversion; 16 / bits
5. Spatial resolution: 4.0lp/mm
6. Tube voltage: 60kv;
7. Target current: 1.0ma;
8. Computer system: Windows 10;
9. Computer size: 14 inch desktop computer (wired and wireless connection computer)
10. Remote control: remote operation software
11. Wired transmission port: gigabit network port;
12. Wireless transmission: 5g WiFi;
13. Overall dimension: 710x530x350mm;
14. Adapter output voltage: DC24V.
15. AC power frequency: 50-60Hz;
16. Weight: 85kg;